Loading patent…
AssigneeIrvine Sensors Corporation
InventorsPeter Lieu, W. Eric Boyd
Estimating the term…
A method for providing a known good integrated circuit die having enhanced planarity from a prepackaged integrated circuit die having a surface warpage such as in a ball grid array (BGA) package is provided. A partially-depackaged integrated circuit package is affixed to a substrate with a spacer element there between such that the active surface of the die within the partially depackaged integrated circuit die is “bowed” slightly upwardly to define a convex surface. The exposed encapsulant on the now-convex surface of the mounted, partially-depackaged integrated circuit package is then lapped or ground away to a predetermined depth so that an integrated circuit die is provided having an enhanced planarity and surface uniformity.
A process for providing an integrated circuit die having improved planar uniformity from a prepackaged integrated circuit package comprising the steps of:
A depackaged die fabricated from a prepackaged integrated circuit prepared by a process comprising the steps of:
A process for providing an integrated circuit die having improved planar uniformity comprising the steps of:
Dependencies are inferred from the claim text.