US 2012/0068338 A1 · IMPEDANCE CONTROLLED PACKAGES WITH METAL SHEET OR 2-LAYER RDL

Abstract

A microelectronic assembly is disclosed that is capable of achieving a desired impedance for raised conductive elements. The microelectronic assembly may include an interconnection element, a surface conductive element, a microelectronic device, a plurality of raised conductive elements, and a bond element. The microelectronic device may overlie the dielectric element and at least one surface conductive element attached to the front surface. The plurality of raised conductive elements may connect the device contacts with the element contacts. The raised conductive elements may have substantial portions spaced a first height above and extending at least generally parallel to at least one surface conductive element, such that a desired impedance may be achieved for the raised conductive elements. A bond element may electrically connect at least one surface conductive element with at least one reference contact that may be connectable to a source of reference potential.

Claims49

Dependent claims

A microelectronic assembly comprising:

an interconnection element including a dielectric element, a plurality of element contacts and at least one reference contact thereon;
a microelectronic device having a rear surface overlying the dielectric element, a front surface remote therefrom, device contacts exposed at the front surface, and at least one surface conductive element attached to the front surface;
a plurality of raised conductive elements connecting the device contacts with the element contacts, the raised conductive elements having substantial portions spaced a first height above and extending at least generally parallel to the at least one surface conductive element, such that a desired impedance is achieved for the raised conductive elements;
and
a bond element electrically connecting the at least one surface conductive element with the at least one reference contact,
wherein the at least one reference contact is connectable to a source of reference potential.

3 more elements

A microelectronic assembly comprising:

an interconnection element having a face;
a microelectronic device overlying the face of the interconnection element, the microelectronic device having a surface, a plurality of first device contacts disposed at the surface, at least one second device contact disposed at the surface, and at least one trace deposited on the surface and electrically connected to the interconnection element, the at least one trace electrically connecting at least one of the first device contacts with the at least one second device contact;
at least one first bond element electrically connecting the at least one second device contact with at least one of the element contacts;
and
at least one metal plane electrically connected to the interconnection element and attached to the microelectronic device at a height from the surface greater than a height of the at least one trace from the surface, the at least one metal plane being connectable to a source of reference potential, such that a desired impedance is achieved for the at least one trace, the at least one trace having at least a substantial portion extending in a direction substantially parallel to a direction in which the metal plane extends;
and
at least one second bond element electrically connecting the metal plane with a reference element of the interconnection element, the reference element being electrically connectable with a source of reference potential.

4 more elements

Dependencies are inferred from the claim text.

Impedance controlled packages with metal sheet or 2-layer rdl

Life of this patent

Impedance controlled packages with metal sheet or 2-layer rdl

Life of this patent

Abstract

Claims49