Printed circuit board having hexagonally aligned bump pads for substrate of semiconductor package, and semiconductor package including the same
AssigneeSamsung Electronics Co., Ltd.
InventorJik-ho SONG
Life of this patent
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Abstract
Provided are a printed circuit board (PCB) having hexagonally aligned bump pads as a substrate of a semiconductor package, and a semiconductor package including the same. The PCB includes: a PCB body; a bottom metal layer at a bottom of the PCB body; and a top metal layer at a top of the PCB body, and the top metal layer includes: vias vertically connected to the PCB body; bump pads hexagonally aligned in a horizontal direction around the vias; and connection patterns connecting the vias to two or more of the bump pads. Accordingly, the number of bump pads in a unit area of the PCB may be increased.
Claims20
A printed circuit board (PCB) as a substrate of a semiconductor package, the PCB comprising:
- a PCB body;
- a bottom metal layer at a bottom of the PCB body;
- and
- a top metal layer at a top of the PCB body,
- wherein the top metal layer comprises:
- vias which are vertically connected to the PCB body;
- bump pads which are hexagonally aligned in a horizontal direction around the vias;
- and
- connection patterns which connect the vias to two or more of the bump pads.
A printed circuit board (PCB) as a substrate of a semiconductor package, the PCB comprising:
- a PCB body;
- a bottom metal layer at a bottom of the PCB body;
- and
- a top metal layer at a top of the PCB body,
- wherein the top metal layer comprises:
- a first bump pad group comprising vias which are vertically connected to the PCB body, bump pads which are hexagonally aligned in a horizontal direction around the vias, and connection patterns which connect the vias to two or more of the bump pads;
- and
- a second bump pad group comprising vias and bump pads having an alignment different from that of the first bump pad group.
A semiconductor package comprising:
- a printed circuit board (PCB) as a substrate of the semiconductor package;
- and
- one or more semiconductor chips which are mounted on a top metal layer of the PCB by using bumps,
- wherein the top metal layer of the PCB comprises:
- a first bump pad group comprising vias which are vertically connected to a PCB body of the PCB, bump pads which are hexagonally aligned in a horizontal direction around the vias, and connection patterns which connect the vias to two or more of the bump pads;
- and
- a second bump pad group comprising vias and bump pads having an alignment different from that of the first bump pad group.
A semiconductor package comprising:
- a printed circuit board (PCB) as a substrate of the semiconductor package;
- and
- one or more semiconductor chips which are mounted on a top metal layer of the PCB by using bumps,
- wherein the top metal layer of the PCB comprises:
- vias which are vertically connected to a PCB body of the PCB;
- bump pads which are hexagonally aligned in a horizontal direction around the vias;
- and
- connection patterns which connect the vias to two or more of the bump pads.
Dependencies are inferred from the claim text.