Wire Bond Through-Via Structure and Method
AssigneeIrvine Sensors Corporation
InventorsRandy Bindrup, W. Eric Boyd, John Leon, James Yamaguchi
Life of this patent
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Abstract
A stackable integrated circuit chip layer and module device that avoids the use of electrically conductive elements on the external surfaces of a layer containing an integrated circuit die by taking advantage of conventional wire bonding equipment to provide an electrically conductive path defined by a wire bond segment that is encapsulated in a potting material so as to define an electrically conductive wire bond “through-via” accessible from at least the lower or second surface of the layer.
Claims17
An electronic device comprising:
- a layer comprising a first surface and a second surface,
- an integrated circuit chip having an active surface with a bond pad and an inactive surface, and,
- a cross-section of an encapsulated wire bond segment in electrical connection with the bond pad and exposed on the second surface of the layer.
A method for making an electronic device comprising the steps of:
- bonding the inactive surface of an integrated circuit chip having a bond pad to a metalized surface of a substrate,
- disposing a wire bond loop having a predetermined height on the metalized surface at a predetermined location with respect to the bond pad,
- encapsulating a predetermined portion the wire bond loop and the integrated circuit chip to define a first surface and a second surface,
- removing a predetermined portion of the encapsulant and the wire bond loop from the first surface to define a wire bond segment having a first terminal end and a second terminal end,
- electrically connecting the bond pad to the first terminal end of the wire bond segment using a conductive lead assembly, and,
- exposing the second terminal end of the wire bond segment on the second surface.
An electronic device provided by a process comprising the steps of:
- bonding the inactive surface of an integrated circuit chip having a bond pad to a metalized surface of a substrate,
- disposing a wire bond loop having a predetermined height on the metalized surface at a predetermined location with respect to the integrated circuit chip,
- encapsulating a predeteiiiiined portion the wire bond loop and the integrated circuit chip to define a first surface and a second surface,
- removing a predetermined portion of the encapsulant and the wire bond loop on the first surface to define a wire bond segment having a first terminal end and a second terminal end,
- electrically connecting the bond pad to the first terminal end of the wire bond segment using a conductive lead assembly, and,
- exposing the second terminal end of the wire bond segment on the second surface.
An electronic device comprising a plurality of stacked layers wherein a first layer and a second layer each comprise:
- a first surface and a second surface,
- an integrated circuit chip having an active surface with a bond pad and an inactive surface,
- a cross-section of an encapsulated wire bond segment in electrical connection with the bond pad and exposed on the second surface of the layer, and,
- wherein the first layer is in electrical communication with the second layer.
An electronic device comprising:
- a layer comprising a first surface and a second surface,
- an integrated circuit chip having an active surface with a bond pad and an inactive surface, and,
- a cross-section of an encapsulated stack of wire bond stud bumps in electrical connection with the bond pad and exposed on the second surface of the layer.
Dependencies are inferred from the claim text.