Integrated circuit packaging system with post and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system comprising:

• providing a stack substrate with a component side;
• connecting an integrated circuit component to the component side;
• attaching a conductive post to the component side and adjacent the integrated circuit component, the conductive post having a protruded end above the integrated circuit component;
• forming a protection layer on the protruded end, the protection layer having a width equal to a width of the conductive post;
• applying a stack encapsulation over the integrated circuit component, over the stack substrate, and around a portion of the conductive post, the protection layer exposed from the stack encapsulation;
• mounting a base package under the stack substrate, base package connected to the stack substrate;
• and
• applying a package encapsulation over at least a portion of the stack package and between the stack package and the base package.

An integrated circuit packaging system comprising:

• a stack substrate with a component side;
• an integrated circuit component connected to the component side;
• a conductive post connected to the component side and adjacent the integrated circuit component, the conductive post having a protruded end above the integrated circuit component;
• a protection layer on the protruded end, the protection layer having a width equal to a width of the conductive post;
• a stack encapsulation over the integrated circuit component, over the stack substrate, and around a portion of the conductive post, the protection layer exposed from the stack encapsulation;
• and
• a base package under the stack substrate, the base package connected to the stack substrate.