Semiconductor device
AssigneeOlympus Medical Systems Corp.
InventorsKazuhisa HOSHI, Jun HIROYA, Seiji IWASAKI, Akira MURAMATSU, Yuichi WATAYA, Toru KUCHIMARU, Hiroshi ISHII, Tomoaki YAMASHITA
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AssigneeOlympus Medical Systems Corp.
InventorsKazuhisa HOSHI, Jun HIROYA, Seiji IWASAKI, Akira MURAMATSU, Yuichi WATAYA, Toru KUCHIMARU, Hiroshi ISHII, Tomoaki YAMASHITA
Estimating the term…
A semiconductor device includes at least two or more groups of external connection terminals to which a substrate that drives a bare chip by inputting a signal from an external apparatus to the bare chip is electrically connected, the at least two or more groups of external connection terminals being formed outside an image area of the bare chip, wherein at least one group of terminals constitutes a first group of terminals, another group of terminals constitutes a second group of terminals, the first group of terminals doubles as the second group of terminals, and a substrate for inspection doubling as a substrate for mounting is electrically connected to the first group of terminals.
A semiconductor device comprising,
A semiconductor device comprising a semiconductor package in which a semiconductor chip is stored in a storage portion,
Dependencies are inferred from the claim text.