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US 2012/0068323 A1Published application
Semiconductor device package and method of making a semiconductor device package
AssigneeInfineon Technologies AG
InventorsChip King Tan, Boon Huan Gooi
Life of this patent
Estimating the term…
Abstract
A method of manufacturing an electronic device is provided. The method comprises providing a carrier sheet, etching the lead frame material sheet to form a recess on a first surface of the lead frame material sheet, placing an electronic chip into the recess of the carrier sheet, and thereafter, selectively etching a second surface of the lead frame material sheet, the second surface being opposite to the first surface.
Claims12
A semiconductor device comprising:
- a plurality of leads, at least one of the leads comprising a recessed portion on a surface of the lead;
- and
- a semiconductor chip being provided in the recessed portion.
An electronic device comprising:
- a plurality of electrical connection elements, at least one of the electrical connection elements comprising a recessed portion on a surface of the electrical connection element;
- and
- an electronic component being provided in the recessed portion.
A electronic device comprising:
- a lead with a recess portion configured to support a semiconductor chip.
Dependencies are inferred from the claim text.