Integrated circuit packaging system with paddle molding and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsZigmund Ramirez Camacho, Henry Descalzo Bathan, Emmanuel Espiritu
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having a hole, a recess, and a pad, the hole over the recess; mounting an integrated circuit to the package paddle; forming a lead having a bottom surface coplanar with a bottom surface of the pad, the lead isolated from the package paddle; attaching connectors directly on the integrated circuit, the lead, and the package paddle; and forming an encapsulation covering the integrated circuit and within the hole and the recess.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a package paddle having a hole, a recess, and a pad, the hole over the recess;
- mounting an integrated circuit to the package paddle;
- forming a lead having a bottom surface coplanar with a bottom surface of the pad, the lead isolated from the package paddle;
- attaching connectors directly on the integrated circuit, the lead, and the package paddle;
- and
- forming an encapsulation covering the integrated circuit and within the hole and the recess.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a package paddle having a hole, a recess, and a pad, the hole over the recess;
- mounting an integrated circuit to the package paddle;
- forming a lead having a bottom surface coplanar with a bottom surface of the pad, the lead isolated from the package paddle;
- attaching a pad-device connector directly on the integrated circuit and the package paddle;
- attaching a lead-device connector directly on the integrated circuit and the lead;
- and
- forming an encapsulation covering the integrated circuit and within the hole and the recess.
An integrated circuit packaging system comprising:
- a package paddle having a hole, a recess, and a pad, the hole over the recess;
- an integrated circuit mounted to the package paddle;
- a lead having a bottom surface coplanar with a bottom surface of the pad, the lead isolated from the package paddle;
- connectors directly on the integrated circuit, the lead, and the package paddle;
- and
- an encapsulation covering the integrated circuit and within the hole and the recess.
Dependencies are inferred from the claim text.