Transition from a chip to a waveguide port
AssigneeTelefonaktiebolaget L M Ericsson (publ)
InventorPer Ligander
Life of this patent
Estimating the term…
Loading patent…
AssigneeTelefonaktiebolaget L M Ericsson (publ)
InventorPer Ligander
Estimating the term…
The present invention relates to a transition from a chip to a waveguide port (47, 47′, 11), the chip (1, 1′, 62) having a first main side (3, 3′, 66) and a second main side (4, 4′, 67), where the first main side (3, 3′, 66) comprises at least one input port (35, 36, 37, 38, 39), arranged to receive an input signal, at least one output port (44, 45; 72), arranged to output an output signal, and at least one electrical functionality. One port (44, 72) of said ports (44, 45; 72; 35, 36, 37, 38, 39) is electrically connected to an electrically conducting probe (48, 48′, 73) that is arranged to extend from said one port (44, 72) and at least partly over the waveguide port (47, 47′, 77) such that a signal may be transferred between said one port (44, 72) and the waveguide port (47, 47′, 77). The present invention also relates to a corresponding package.
A transition from a first planar structure (1, 1′, 62) in the form of a chip to a waveguide port (47, 47′, 77), the first planar structure (1, 1′, 62) having a first main side (3, 3′, 66) and a second main side (4, 4′, 67), where the first main side (3, 3′, 66) comprises at least one input port (35, 36, 37, 38, 39), arranged to receive an input signal, at least one output port (44, 45;
A transition according to any one of the preceding claims, characterized in that the first planar structure is a chip (1, 1′, 62) having a plurality of electrical functions, and where bond wires (46) connect chip connections (35, 36, 37, 38, 39, 40, 41, 42, 43, 45) to corresponding package connections (22, 23, 24, 25, 26, 7, 8, 20, 19, 9) comprised in the base structure (5), where the base structure (5) and the chip (1, 1′) at least partly are comprised inside a moulding (32), forming a package with said package connections (22, 23, 24, 25, 26, 7, 8, 20, 19, 9) accessible.
A transition according to any one of the preceding claims, characterized in that an electrically conducting enclosure (49, 49′, 82) is positioned over the waveguide port (47, 47′, 77), such that a cavity (50, 50′, 84) having electrically conducting walls (51, 52, 53, 54, 55;
A package comprising a chip (1, 1′, 62) having a plurality of electrical functions, and where bond wires (46) connect chip connections (35, 36, 37, 38, 39, 40, 41, 42, 43, 45) to corresponding package connections (22, 23, 24, 25, 26, 7, 8, 20, 19, 9) comprised in a base structure (5), where the base structure (5) and the chip (1, 1′) at least partly are comprised inside a moulding (32), forming said package with said package connections (22, 23, 24, 25, 26, 7, 8, 20, 19, 9) accessible, characterized in that the package comprises a transition from the chip (1, 1′, 62) to a waveguide port (47, 47′, 77), the chip (1, 1′, 62) having a first main side (3, 3′, 66) and a second main side (4, 4′, 67), where the first main side (3, 3′, 66) comprises at least one input port (35, 36, 37, 38, 39), arranged to receive an input signal, at least one output port (44, 45;
Dependencies are inferred from the claim text.