Semiconductor device and method of forming conductive TSV with insulating annular ring

A method of making a semiconductor device, comprising:

• providing a semiconductor wafer;
• forming a first via through the semiconductor wafer;
• depositing a conductive material in the first via to form a conductive via;
• after forming the conductive via, forming a second via around the conductive via through the semiconductor wafer;
• and
• depositing a first insulating material in the second via to form an insulating ring.

A method of making a semiconductor device, comprising:

• providing a semiconductor die;
• forming a first via through the semiconductor die;
• depositing a conductive material in the first via to form a conductive via;
• forming a second via outside the conductive via through the semiconductor die;
• and
• depositing a first insulating material in the second via to form an insulating ring.

A semiconductor device, comprising:

• a semiconductor die;
• a conductive via formed through the semiconductor die;
• and
• an insulating ring formed outside the conductive via through the semiconductor die.