Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device

A method for producing an adhesive sheet including a release substrate, an adhesive layer, a tacky layer and a substrate film, which are laminated in order, comprising:

• a first laminating step in which the adhesive layer, the tacky layer, and the substrate film are laminated in order on the release substrate;
• and
• a first cutting step in which an incision is made from an opposite side bringing contact with the tacky layer on the substrate film until it reaches the release substrate to cut the adhesive layer, the tacky layer and the substrate film in pre-determined plane shapes and to form a first incision in the release substrate,
• wherein the incision is made so that the first incision has a depth of less than the thickness of the release substrate and 25 μm or less in the first cutting step.

A method for producing an adhesive sheet including a release substrate, an adhesive layer, a tacky layer, and substrate film, which are laminated in order, comprising:

• a laminating step in which the adhesive layer is laminated on the release substrate;
• a cutting step in which an incision is made from an opposite side bringing contact with the adhesive layer on the release substrate until the incision reaches the release substrate to cut the adhesive layer in a pre-determined plane shape and to form a first incision in the release substrate;
• and
• another laminating step in which the tacky layer, and the substrate film are laminated in order on the adhesive layer,
• wherein the incision is made so that the first incision has a depth of less than the thickness of the release substrate and 25 μm or less in the second cutting step.