Semiconductor package including decoupling semiconductor capacitor

A semiconductor package, comprising:

• a packaging substrate including a first bond finger, a second bond finger, and a third bond finger;
• a first decoupling semiconductor capacitor mounted on the packaging substrate, the first decoupling semiconductor capacitor including a first capacitor pad, a second capacitor pad, and a third capacitor pad, the first capacitor pad being electrically connected to a first electrode of the first decoupling semiconductor capacitor, the second capacitor pad being electrically connected to a second electrode of the first decoupling semiconductor capacitor, and the third capacitor pad being electrically insulated from the first electrode and the second electrode of the first decoupling semiconductor capacitor;
• a first semiconductor chip mounted on the packaging substrate, the first semiconductor chip including a first chip pad, a second chip pad, and a third chip pad;
• a first bonding wire electrically connecting the first bond finger and the first capacitor pad;
• a second bonding wire electrically connecting the first capacitor pad and the first chip pad;
• a third bonding wire electrically connecting the second bond finger and the second capacitor pad;
• a fourth bonding wire directly and electrically connecting the second capacitor pad and the second chip pad;
• a fifth bonding wire electrically connecting the third bond finger and the third capacitor pad;
• and
• a sixth bonding wire electrically connecting the third capacitor pad and the third chip pad.

A semiconductor device package, comprising:

• a packaging substrate;
• a semiconductor chip on the packaging substrate;
• an encapsulant, the encapsulant enclosing the semiconductor chip, the semiconductor chip being between the packaging substrate and the encapsulant;
• and
• a semiconductor capacitor device, the semiconductor capacitor device being separate from the semiconductor chip and electrically coupled a power connection of the semiconductor chip, the capacitor device being within the encapsulant.