Semiconductor structure and method for making same
AssigneeInfineon Technologies AG
InventorThoralf KAUTZSCH
Life of this patent
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Abstract
One or more embodiments relate to a method of forming a semiconductor structure, comprising: providing a semiconductor substrate; forming an opening within the substrate; forming a conductive layer within the opening; and forming a semiconductor layer over the conductive layer.
Claims61
A method of forming a semiconductor structure, comprising:
- providing a semiconductor substrate;
- forming an opening within said substrate;
- forming a conductive layer within said opening;
- and
- forming a semiconductor layer over said conductive layer.
A method of forming a semiconductor structure, comprising:
- providing a semiconductor substrate;
- forming an opening within said substrate;
- forming a conductive layer within said opening;
- forming a semiconductor layer, said semiconductor layer at least partially closing said opening.
A method of forming a semiconductor structure, comprising:
- providing a semiconductor substrate;
- forming a first device within said substrate;
- and
- forming a semiconductor layer over said first device.
The method of 28, wherein said reflow includes a hydrogen ambient bake process.
A method of forming a capacitor, comprising:
- forming at least one capacitor plate within a semiconductor substrate;
- and
- forming a semiconductor layer over said capacitor plate.
A semiconductor structure, comprising:
- a semiconductor substrate;
- a conductive layer disposed within said substrate;
- and
- a semiconductor layer overlying said conductive layer.
A semiconductor structure, comprising:
- a semiconductor substrate;
- a first device disposed within said substrate;
- and
- a semiconductor layer overlying said first device.
A semiconductor structure, comprising:
- a semiconductor substrate;
- a device disposed within said substrate, said device substantially enclosed by at least one semiconductor material.
A semiconductor structure, comprising:
- a semiconductor substrate;
- a conductive layer disposed within said substrate, said conductive layer substantially enclosed by at least one semiconductor material.
Dependencies are inferred from the claim text.