Image sensing device and method of manufacturing the same
AssigneeKabushiki Kaisha Toshiba
InventorsAtsuko KAWASAKI, Kenichiro Hagiwara, Hirokazu Sekine
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Abstract
According to one embodiment, a solid-state image sensing device includes a semiconductor substrate on which a plurality of pixels are arranged, a transparent substrate including a first through via provided in an opening formed in advance to extend through, an adhesive including a second through via connected to the first through via and configured to bond the semiconductor substrate and the transparent substrate while exposing the pixels, and an imaging lens unit arranged on the transparent substrate.
Claims17
A solid-state image sensing device comprising:
- a semiconductor substrate on which a plurality of pixels are arranged;
- a transparent substrate including a first through via provided in an opening formed in advance to extend through;
- an adhesive including a second through via connected to the first through via and configured to bond the semiconductor substrate and the transparent substrate while exposing the pixels;
- and
- an imaging lens unit arranged on the transparent substrate.
A solid-state image sensing device comprising:
- a semiconductor substrate on which a plurality of pixels are arranged;
- a transparent substrate including a first through via provided in an opening formed in advance to extend through;
- an adhesive including a second through via connected to the first through via and configured to bond the semiconductor substrate and the transparent substrate while exposing the pixels;
- and
- an imaging lens unit arranged on the transparent substrate,
- wherein an interconnection layer that forms a driving circuit portion to drive the pixels includes multilayered interconnections.
A method of manufacturing an image sensing device comprising:
- forming a plurality of pixels on a semiconductor substrate;
- forming an adhesive on the semiconductor substrate while exposing the pixels;
- forming, in the adhesive, a first opening to be connected to a pad and a second opening to be connected to each pixel so as to be aligned with openings formed in a transparent substrate in advance;
- placing the transparent substrate on the adhesive and bonding the transparent substrate to the semiconductor substrate while aligning the openings formed in advance with the first opening and the second opening formed in the adhesive;
- forming a through via in the semiconductor substrate;
- burying a conductive substance in the openings formed in the transparent substrate in advance, the first opening, and the second opening to form a through via of the transparent substrate and a through via of the adhesive;
- and
- forming an imaging lens unit on the transparent substrate.
Dependencies are inferred from the claim text.