Devices Having Enhanced Electromagnetic Radiation Detection and Associated Methods
AssigneeSiOnyx, Inc.
InventorsSusan Alie, Martin U. Pralle, Chintamani Palsule, Jeffrey McKee, Xia Li
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Abstract
Photosensitive semiconductor devices and associated methods are provided. In one aspect, a semiconductor device can include a semiconductor substrate and a semiconductor layer coupled to the semiconductor substrate, where the semiconductor layer has a device surface opposite the semiconductor substrate. The device also includes at least one textured region coupled between the semiconductor substrate and the semiconductor layer. In another aspect, the device further includes at least one dielectric layer coupled between the semiconductor substrate and the semiconductor layer.
Claims38
A semiconductor device, comprising:
- a semiconductor substrate;
- a semiconductor layer coupled to the semiconductor substrate, the semiconductor layer having a device surface opposite the semiconductor substrate;
- and
- at least one textured region coupled between the semiconductor substrate and the semiconductor layer.
A method of making a semiconductor device, comprising:
- texturing at least a portion of a surface of a semiconductor layer to form a textured region;
- depositing a first dielectric layer onto the semiconductor layer such that the textured region is disposed between the semiconductor layer and the first dielectric layer;
- and
- wafer bonding the first dielectric layer to a second dielectric layer disposed on a semiconductor substrate.
A method of protecting a textured region from contamination during manufacture of a semiconductor device, comprising:
- texturing at least a portion of a surface of a semiconductor layer to form a textured region;
- depositing a first dielectric layer onto the semiconductor layer such that the textured region is disposed between the semiconductor layer and the dielectric layer;
- and
- wafer bonding the first dielectric layer to a second dielectric layer disposed on a semiconductor substrate, wherein the textured region is protected from contamination during further manufacturing processes by the semiconductor layer and the semiconductor substrate.
Dependencies are inferred from the claim text.