US 2012/0068278 A1 · PULL UP ELECTRODE AND WAFFLE TYPE MICROSTRUCTURE

Abstract

The present invention generally relates to MEMS devices and methods for their manufacture. The cantilever of the MEMS device may have a waffle-type microstructure. The waffle-type microstructure utilizes the support beams to impart stiffness to the microstructure while permitting the support beam to flex. The waffle-type microstructure permits design of rigid structures in combination with flexible supports. Additionally, compound springs may be used to create very stiff springs to improve hot-switch performance of MEMS devices. To permit the MEMS devices to utilize higher RF voltages, a pull up electrode may be positioned above the cantilever to help pull the cantilever away from the contact electrode.

Claims20

Dependent claims

A method of producing a micro-electromechanical device, comprising:

depositing a first sacrificial layer over a dielectric layer;
depositing a first structural layer over the first sacrificial layer;
depositing a second sacrificial layer over the first structural layer;
forming one or more first vias through the second sacrificial layer to expose at least a portion of the first structural layer;
depositing a second structural layer within the one or more first vias and over the second sacrificial layer;
depositing a third sacrificial layer over the second structural layer;
and
removing the first sacrificial layer, the second sacrificial layer and the third sacrificial layer to free the first structural layer and the second structural layer within a cavity.

5 more elements

A micro-electromechanical device, comprising:

a first structural layer coupled to one or more first electrodes;
a second structural layer spaced from the first structural layer to define a space between the first structural layer and the second structural layer;
a plurality of posts disposed within the space and coupled between the first structural layer and the second structural layer, each of the plurality posts spaced from an adjacent post, the first structural layer, second structural layer, and plurality of posts collectively forming a cantilever that is disposed within a cavity;
and
one or more electrically conductive compound springs spaced from the cantilever and disposed within the cavity.

2 more elements

Dependencies are inferred from the claim text.

Pull up electrode and waffle type microstructure

Life of this patent

Pull up electrode and waffle type microstructure

Life of this patent

Abstract

Claims20