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US 2012/0068277 A1Published application
Semiconductor Manufacturing and Semiconductor Device with semiconductor structure
AssigneeInfineon Technologies AG
InventorsThoralf KAUTZSCH, Boris BINDER, Frank HOFFMANN, Uwe RUDOLPH
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Abstract
Embodiments related to semiconductor manufacturing and semiconductor devices with semiconductor structure are described and depicted.
Claims22
A method comprising:
- removing semiconductor material in at least first and second portions of a semiconductor substrate such that a semiconductor structure in the semiconductor substrate is formed between the removed first and second portions;
- applying a migration process to the semiconductor substrate such that a first part of the semiconductor structure remains after the migration process and semiconductor material of a second part of the semiconductor structure migrates to other locations,
- wherein a continuous space being free of semiconductor material and extending above the remaining first part of the structure and a continuous semiconductor material layer extending above the continuous space from the first to the second portions are formed by the migration of the material of the second part of the semiconductor structure.
A method of fabricating a device comprising:
- removing bulk material in a semiconductor substrate, wherein a semiconductor structure extending into the semiconductor substrate is formed by the removing of bulk material;
- forming a protection layer on a wall of the semiconductor structure such that a first part of the semiconductor structure is covered by the protection layer and a second part of the semiconductor structure is not covered by the protection layer;
- and
- processing the semiconductor substrate such that the first part of the semiconductor structure remains and the second part of the semiconductor structure is removed, wherein a space free of semiconductor material is formed by the processing which continuously extends above the remaining first part of the semiconductor structure.
1 more element
A device comprising:
- a semiconductor substrate of bulk material;
- a flexible element, the flexible element being formed from bulk material of the semiconductor substrate;
- a continuous layer comprising bulk material above the flexible element;
- and
- a continuous material-free space between the semiconductor substrate and the layer comprising bulk material.
2 more elements
Dependencies are inferred from the claim text.