Back to results
US 2012/0068265 A1Published application
Wiring layer structure and process for manufacture thereof
AssigneesUlvac, Inc., Mitsubishi Materials Corporation
InventorsKazunari Maki, Kenichi Yaguchi, Yosuke Nakasato
Life of this patent
Estimating the term…
Abstract
This wiring layer structure includes: an underlying substrate of a semiconductor substrate or a glass substrate; an oxygen-containing Cu layer or an oxygen-containing Cu alloy layer which is formed on the underlying substrate; an oxide layer containing at least one of Al, Zr, and Ti which is formed on the oxygen-containing Cu layer or the oxygen-containing Cu alloy layer; and a Cu alloy layer containing at least one of Al, Zr, and Ti which is formed on the oxide layer.
Claims20
A wiring layer structure comprising:
- an underlying substrate of a semiconductor substrate or a glass substrate;
- an oxygen-containing Cu layer or an oxygen-containing Cu alloy layer which is formed on the underlying substrate;
- an oxide layer containing at least one of Al, Zr, and Ti which is formed on the oxygen-containing Cu layer or the oxygen-containing Cu alloy layer;
- and
- a Cu alloy layer containing at least one of Al, Zr, and Ti which is formed on the oxide layer.
2 more elements
A method for manufacturing a wiring layer structure, comprising:
- in series,
- a step (a) of performing sputtering in a O2 atmosphere using a target containing at least Cu on an underlying substrate of a semiconductor substrate or a glass substrate;
- a step (b) of performing sputtering in an inert gas atmosphere using a Cu alloy containing at least one of Al, Zr, and Ti as a target;
- a step (c) of forming a wiring layer pattern in layers formed by the step (a) and the step (b) through etching, and exposing a portion of the underlying substrate;
- and
- a step (d) of performing a hydrogen plasma treatment to terminate dangling bonds which exist in an exposed surface of the underlying substrate,
- wherein the method further comprises a step (e) of performing annealing in a hydrogen atmosphere after the step (b) and before the step (d).
4 more elements
Dependencies are inferred from the claim text.