Thermally efficient packaging for a photonic device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHung-Pin Chang, Yung-Chi Lin, Chia-Lin Yu, Jui-Ping Hung, Chien Ling Hwang, Chen-Hua Yu
Life of this patent
Estimating the term…
Abstract
The present disclosure provides a method of packaging for a photonic device, such as a light-emitting diode device. The packaging includes an insulating structure. The packaging includes first and second conductive structures that each extend through the insulating structure. A substantial area of a bottom surface of the light-emitting diode device is in direct contact with a top surface of the first conductive structure. A top surface of the light-emitting diode device is bonded to the second conductive structure through a bonding wire.
Claims20
An apparatus comprising a packaging for a light-emitting diode (LED) device, the packaging includes:
- an insulating structure;
- and
- first and second conductive structures that each extend through the insulating structure;
- wherein:
- a substantial area of a bottom surface of the LED device comes into contact with a top surface of the first conductive structure;
- and
- a top surface of the LED device is bonded to the second conductive structure through a bonding wire.
An apparatus comprising a packaging structure for a photonic device, the packaging structure includes:
- an insulating structure;
- and
- a thermally conductive structure partially disposed in the insulating structure;
- wherein a substantial portion of a surface of the photonic device is in direct contact with the thermally conductive structure.
A method of packaging a light-emitting diode (LED) device, comprising:
- forming an insulating structure;
- forming a thermally conductive structure partially in the insulating structure;
- providing the LED device, the LED device having a top surface and a bottom surface;
- and
- bonding the LED device to the thermally conductive structure, the bonding being carried out in a manner so that a substantial portion of one of the top and bottom surfaces of the LED device is in direct contact with the thermally conductive structure.
Dependencies are inferred from the claim text.