Photoelectric device, method of fabricating the same and packaging apparatus for the same
AssigneeAdvanced Optoelectronic Technology, Inc.
InventorsChester KUO, Hung-Chin LIN
Life of this patent
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Abstract
A photoelectric device includes a ceramic substrate defining a cavity in a top thereof and having two electrode layers beside the cavity. A photoelectric die is received in the cavity. A first packing layer is received in the cavity and encapsulates the photoelectric die. The photoelectric die is electrically connected with the electrode layers via two wires. A reflective cup is mounted on the ceramic substrate and defines a receiving space above the top of the ceramic substrate and the first packing layer. A second packing layer is received in the receiving space and covers the first packing layer.
Claims13
A photoelectric device, comprising:
- a ceramic substrate, comprising a thermal dissipation layer and at least two electrode layers electrically insulating from the thermal dissipation layer;
- a photoelectric die disposed on a top surface of the thermal dissipation layer and electrically connecting to the at least two electrode layers;
- a reflective cup disposed on a top surface of the ceramic substrate so as to form a first accommodation space, wherein the reflective cup comprises a slantwise surface surrounding the first accommodating space;
- a first packaging layer disposed on a top surface of the photoelectric die;
- a second packaging layer disposed within the first accommodation space and disposed on a top surface of the first packaging layer;
- and
- a lens structure attached in the accommodation space and disposed on a top surface of the second packaging layer.
A photoelectric device, comprising:
- a ceramic substrate, comprising a thermal dissipation layer and at least two electrode layers electrically insulating from the thermal dissipation layer;
- a photoelectric die disposed on a top surface of the thermal dissipation layer and electrically connecting to the at least two electrode layers;
- a plurality of reflective cups disposed on a top surface of the ceramic substrate so as to form an accommodation space;
- a plurality of packaging layers disposed within the accommodation space, wherein at least one of the plurality of packaging layers is disposed on the photoelectric die;
- and
- a lens structure attached on the ceramic substrate and covering the plurality of packaging layers.
A photoelectric device, comprising:
- a ceramic substrate defining a cavity in a top thereof and having two electrode layers beside the cavity;
- a photoelectric die received in the cavity;
- a first packing layer received in the cavity and encapsulating the photoelectric die, the photoelectric die being electrically connected with the electrode layers;
- a reflective cup mounted on the ceramic substrate and defining a receiving space above the top of the ceramic substrate and the first packing layer;
- and
- a second packing layer received in the receiving space and covering the first packing layer.
Dependencies are inferred from the claim text.