Measuring apparatus
AssigneeIndustrial Technology Research Institute
InventorsRa-Min Tain, Ming-Ji Dai, Shyh-Shyuan Sheu, Chih-Sheng Lin, Shih-Hsien Wu
Life of this patent
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Abstract
A measuring apparatus including a first chip, a first circuit layer, a first heater, a first stress sensor and a second circuit layer is provided. The first chip has a first through silicon via, a first surface and a second surface opposite to the first surface. The first circuit layer is disposed on the first surface. The first heater and the first stress sensor are disposed on the first surface and connected to the first circuit layer. The second circuit layer is disposed on the second surface. The first heater comprises a plurality of first switches connected in series to generate heat.
Claims28
A measuring apparatus, comprising:
- a first chip, having a first through silicon via, a first surface and a second surface opposite to the first surface;
- a first circuit layer, disposed on the first surface;
- a first heater, disposed on the first surface, and electrically connected to the first circuit layer, wherein the first heater comprises a plurality of first switches connected in series to generate heat;
- a first stress sensor, disposed on the first surface, and electrically connected to the first circuit layer;
- and
- a second circuit layer, disposed on the second surface.
Dependencies are inferred from the claim text.