Resin composition and semiconductor device produced by using the same
AssigneeSumitomo Bakelite Co., Ltd.
InventorsHikaru OKUBO, Nobuki Tanaka, Itaru Watanabe
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AssigneeSumitomo Bakelite Co., Ltd.
InventorsHikaru OKUBO, Nobuki Tanaka, Itaru Watanabe
Estimating the term…
A resin composition which is excellent in quick curing and can be used for curing in conventionally used ovens, and a semiconductor device which is excellent in reliability such as solder crack resistance or the like when the resin composition is used as a die attach material for semiconductor. Further preferably, a resin composition which has a sufficient low stress property, good adhesion and excellent bleeding property. A resin composition comprising a filler (A), the compound (B) comprising a structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.
1-41. (canceled)
A resin composition used as an adhesive bonding a semiconductor chip or a heat dissipating member comprising a filler (A), the following compound (B), a thermal radical initiator (C), a reactive diluent (I) and at least one kind selected from the group consisting of the following compound (D), an acrylic ester compound (E) represented by the following formula (5), the following acrylamide compound (F) and the following compound (H), and substantially not containing a photo polymerization initiator:
Dependencies are inferred from the claim text.