Device Package and Methods for the Fabrication Thereof
AssigneeNuvotronics, LLC
InventorsDavid William Sherrer, James MacDonald
Life of this patent
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Abstract
Disclosed and claimed herein is a microwave assembly having a substrate comprising a microwave device; said device having a die, a first layer having a dielectric constant between about 1.00 and about 1.45 and a thickness between about 0.05 and about 2 mm along with one or more layers chosen from an absorbing layer, an EMI blocking layer, a layer comprising conductive material or a metal cover.
Claims27
A method of forming a microwave assembly, comprising:
- a. providing a microwave circuit comprising at least one microwave transmission line.
- b. forming a dielectric layer having a dielectric constant between about 1.01 and about 2.00 over the circuit;
- c. forming an ionic barrier layer comprising a silicone over the dielectric layer;
- d. forming an electromagnetic interference blocking layer over the ionic barrier layer;
- and
- e. forming a second ionic barrier layer comprising a silicone over said electromagnetic interference blocking layer.
A method of forming a microwave assembly comprising:
- a. providing a microwave circuit comprising at least one microwave transmission line;
- b. forming at least one dielectric layer having a dielectric constant between about 1.01 and about 2.00 over the circuit;
- c. forming a least one electromagnetic interference blocking layer over the at least one dielectric layer;
- and
- d. forming at least one ionic barrier layer over the at least one electromagnetic interference blocking layer or the at least one dielectric layer.
A method of forming a microwave assembly, comprising:
- a. providing a microwave circuit comprising at least one microwave transmission line;
- b. forming at least one dielectric layer having a dielectric constant between about 1.01 and about 2.00 over the microwave circuit;
- and
- c. forming at least one ionic barrier layer over the at least one dielectric layer.
A non-hermetic package for protecting a microwave assembly comprising:
- a. a microwave circuit comprising at least one microwave transmission line;
- b. at least one dielectric layer having a dielectric constant between about 1.01 and about 2.00 over the microwave circuit;
- c. at least one electromagnetic interference blocking layer over the at least one dielectric layer;
- and
- d. at least one ionic barrier layer over the at least one electromagnetic interference blocking layer or the at least one dielectric layer.
A non-hermetic package for protecting a microwave assembly comprising:
- a. a microwave circuit comprising at least one microwave transmission line;
- b. at least one dielectric layer having a dielectric constant between about 1.01 and about 2.00 over the microwave circuit;
- and
- c. at least one ionic barrier layer over the at least one dielectric layer.
Dependencies are inferred from the claim text.