Plating apparatus and plating method
AssigneeKabushiki Kaisha Toshiba
InventorsFumito Shoji, Hiroshi Ota
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Abstract
A plating apparatus includes a plating bath configured to perform plating processing of a substrate with a plating solution including an inorganic constituent and an organic constituent introduced into the plating bath, a chemical supplying unit configured to supply each chemical of the inorganic constituent and the organic constituent, an electrode configured to dispose in the plating solution and the electrode configured to selectively adsorb a by-product produced from the organic constituent, and an electric current applying unit configured to apply a predetermined electric current to the electrode.
Claims20
A plating apparatus, comprising:
- a plating bath configured to perform plating processing of a substrate with a plating solution including an inorganic constituent and an organic constituent introduced into the plating bath;
- a chemical supplying unit configured to supply each chemical of the inorganic constituent and the organic constituent;
- an electrode configured to dispose in the plating solution and the electrode configured to selectively adsorb a by-product produced from the organic constituent;
- and
- an electric current applying unit configured to apply a predetermined electric current to the electrodes.
A plating method, comprising:
- preparing a plating solution to be predetermined concentrations of an inorganic constituent and an organic constituent in the plating solution respectively;
- immersing a substrate in the plating solution and performing plating processing;
- and
- applying a predetermined electric current to electrode provided in the plating solution and selectively adsorbing the by-product produced from the organic constituent onto the electrode.
Dependencies are inferred from the claim text.