Nickel electroplating solution and chip parts using the same

Abstract

Disclosed herein is a nickel electroplating solution and chip parts using the same, and more particularly, to a nickel electroplating solution including: nickel metal; nickel chloride; boric acid; a first additive of at least one selected from a group consisting of benzene, naphthalene, xylene, sulfonic acid, sodium sulfonate, and saccharine (C7H5NO3S); and a second additive of at least one selected from a group consisting of sodium dialkyl sulfosuccinate, sodium lauryl sulfate, polyethylene glycol, polyethylene glycol methylether, and polyethylene glycol lauryl amineether to have excellent smoothness and wettability, thereby forming a nickel electroplating layer which is uniform and smooth and has no unplated part and improve soldering characteristics regardless of the surface state and structural shape of an external terminal electrode which is a plated article, and chip parts using the same.

Dependencies are inferred from the claim text.