Package substrate unit and method for manufacturing package substrate unit
AssigneeFujitsu Limited
InventorsHnin Nway San Nang, Kazuya Arai, Kei Fukui, Shinpei Ikegami, Yasuhito Takahashi, Hideaki Yoshimura, Hitoshi Suzuki
Life of this patent
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Abstract
A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer formed on the top surface of the insulation layer, conductive pads formed on the top surface of the conductive seed metal layer, metal posts formed substantially in the central portion on the top surface of the conductive pads, and a solder resist layer that is formed to surround the conductive pads and the metal posts.
Claims11
A package substrate unit comprising:
- an insulation layer;
- and
- an electrode unit that is formed on the insulation layer to establish an electrical joint, via a solder, with an end terminal of an electronic component positioned opposite to the insulation layer, wherein
- the electrode unit has a protrusion that protrudes toward the electronic component.
A package substrate unit comprising:
- an electronic component;
- an insulation layer;
- and
- an electrode unit that is formed on the insulation layer for establishing an electrical joint, via a solder, with an end terminal of the electronic component positioned opposite to the insulation layer, wherein
- the electrode unit has a protrusion that protrudes toward the electronic component.
A method for manufacturing a package substrate unit, the method comprising:
- forming a core layer;
- forming a buildup layer on the core layer;
- forming, on a surface of the buildup layer, an electrode unit for establishing an electrical joint, via a solder, with an end terminal of an electronic component;
- forming, on the electrode unit, a protrusion that protrudes toward the electronic component;
- forming a solder resist layer that surrounds the electrode unit and the protrusion;
- forming, on the solder resist layer, an opening at the formation position of the protrusion;
- and
- printing a solder bump at the opening.
Dependencies are inferred from the claim text.