Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

A multi-layer printed circuit board, comprising:

• a core substrate having a first surface and a second surface on an opposite side of the first surface;
• a plurality of lower interlayer resin insulating layers formed on the first and second surfaces of the core substrate, respectively;
• a plurality of through-hole conductors formed in a plurality of penetrating holes penetrating through the core substrate and the lower interlayer resin insulating layers;
• and
• a plurality of via-hole conductors formed in a plurality of openings formed in the upper interlayer resin insulating layers, respectively,
• wherein the through-hole conductors comprise conductive films formed along inner wall surfaces of the penetrating holes and resin fillers filling inner spaces formed by the conductive films formed along the inner wall surfaces of the penetrating holes, respectively, the via-hole conductors comprise conductive films formed along surfaces of the openings, respectively, and the through-hole conductors have conductor layers covering surfaces of the resin fillers at end portions of the through-hole conductors, respectively.