Solder adhesive and a production method for the same, and an electronic device comprising the same
AssigneeDuksan Hi-Metal Co., Ltd.
InventorsYong Un Jang, Sung Chul Kim, Yong Cheol Chu, Seung Jun Jang, Yoon Sang Son
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Abstract
The present invention relates to a solder adhesive and a production method for the same, and to an electronic device comprising the same, and more specifically it relates to a solder adhesive comprising an alloy including tin and having a melting point of from 130 to 300° C., a first binder including a rosin compound, and a second binder having a thermosetting resin, as well as to a production method for the same and an electronic device comprising the same.
Claims20
A solder adhesive comprising:
- an alloy having a melting point of 130° C.˜300° C. and comprising tin;
- a first binder comprising a rosin compound;
- and
- a second binder comprising a thermosetting resin.
A solder adhesive comprising:
- an alloy having a melting point of 175° C.˜250° C., and comprising at least one material selected from the group consisting of a Sn-3.0Ag-0.5Cu-based alloy, a Sn-3.9Ag-0.6Cu-based alloy, and a Sn—Pb-based alloy;
- a first binder comprising a water-soluble rosin compound;
- and
- a second binder comprising at least one of a condensation polymerized resin of phenol-melamine and an epoxy resin.
An electronic device comprising:
- a substrate;
- a solder ball formed on the substrate;
- an intermetallic-compound layer formed between the substrate and the solder ball;
- and
- an adhesive portion surrounding a periphery of the solder ball.
A method for manufacturing a solder adhesive, comprising:
- a step of modifying a thermosetting resin and a rosin compound by adding at least one material selected from the group consisting of hydrogenated cast oil, siloxane-imide, liquid polybutadiene rubber, silica, and acrylate into the thermosetting resin and the rosin compound;
- a step of forming a compound by mixing the thermosetting resin and the rosin compound with an alloy, wherein the alloy comprising Sn, and at least one material selected from the group consisting of Ag, Cu, Bi, Zn, In, and Pb;
- and
- a step of dispersing the compound.
Dependencies are inferred from the claim text.