Heat-radiating substrate and method for manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSung Keun PARK, Chang Hyun LIM, Seog Moon CHOI, Kwang Soo KIM, Jung Eun KANG
Life of this patent
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Abstract
Disclosed herein is a heat-radiating substrate, including: a copper substrate; an alumina layer formed on one side of the copper substrate; a first circuit layer formed on the alumina layer; and a second circuit layer formed on the first circuit layer, wherein a heat-radiating element is mounted on a first pad of the first circuit layer or a second pad of the second circuit layer, or is directly mounted on the exposed side of the copper substrate after forming an opening on the alumina layer.
Claims19
A heat-radiating substrate, comprising:
- a copper substrate;
- an alumina layer formed on one side of the copper substrate;
- and
- a first circuit layer formed on the alumina layer and including a first circuit pattern and a first pad.
A method of manufacturing a heat-radiating substrate, comprising:
- providing an anodized substrate including an aluminum substrate and an alumina layer formed on both sides of the aluminum substrate;
- forming a copper substrate on one side of the anodized substrate;
- removing the anodized substrate except for a portion of the alumina layer of the anodized substrate which is in contact with the copper substrate;
- and
- forming a first circuit layer including a first circuit pattern and a first pad on the exposed surface of the alumina layer which is in contact with the copper substrate.
A method of manufacturing a heat-radiating substrate, comprising:
- providing an anodized substrate including an aluminum substrate and an alumina layer formed on both sides of the aluminum substrate;
- forming a copper substrate on one side of the anodized substrate;
- removing the alumina layer formed on the side of the aluminum substrate on which the copper substrate was not formed and then partially removing the aluminum substrate to form a first circuit layer including a first circuit pattern and a first pad;
- and
- forming a second circuit layer including a second circuit pattern corresponding to the first circuit pattern of the first circuit layer and a second pad corresponding to the first pad of the first circuit layer.
Dependencies are inferred from the claim text.