Sealing member for electronic component package and electronic component package
AssigneeDaishinku Corporation
InventorNaoki KOHDA
Life of this patent
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Abstract
A sealing member for an electronic component package includes, on another principal surface of a base material constituting the sealing member for the electronic component package, an external terminal electrode, a wiring pattern, and a resin material. The external terminal electrode is to be electrically coupled to an outside of the electronic component package. The wiring pattern is configured to couple an electronic component element on one principal surface of the base material to the external terminal electrode. The resin material is layered over the other principal surface and the wiring pattern. The external terminal electrode is layered over the wiring pattern and the resin material.
Claims4
A sealing member for an electronic component package, the electronic component package comprising:
- a first sealing member having one principal surface on which an electronic component element is to be mounted, the first sealing member serving as the sealing member;
- and a second sealing member opposite the first sealing member, the second sealing member hermetically enclosing an electrode of the electronic component element,
- wherein the sealing member comprises, on another principal surface of a base material constituting the sealing member for the electronic component package:
- an external terminal electrode to be electrically coupled to an outside of the electronic component package;
- a wiring pattern configured to couple the electronic component element on the one principal surface to the external terminal electrode;
- and a resin material, and
- wherein the resin material is layered over the other principal surface and the wiring pattern, and the external terminal electrode is layered over the wiring pattern and the resin material.
Dependencies are inferred from the claim text.