Heat dissipating apparatus
AssigneesHon Hai Precision Industry Co., Ltd., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
InventorsHONG-ZHI SUN, CHEN CHEN, YANG LI
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Abstract
A heat dissipating apparatus comprises a cooler, an air duct, and a cooling fan. a cooler secured to a circuit board of a host; the cooler is secured to a circuit board of a host; the air duct, covers the cooler, comprises a side tray that is substantially perpendicular to the circuit board; the cooling fan is secured to the cooler and located on a side of the cooler, and adjacent to the side tray; a gap is defined between the side tray and the cooler, an air guiding board is located in the gap and extends towards a VRM that is secured to the circuit board, and the air guiding board is configured to direct air flowing towards the VRM.
Claims20
A heat dissipating apparatus comprising:
- a cooler secured to a circuit board of a host;
- an air duct, covering the cooler, comprising a side tray substantially perpendicular to the circuit board;
- a cooling fan secured to the cooler and located on a side of the cooler and adjacent to the side tray;
- wherein an air guiding board is secured to the side tray and located between the side tray and the cooler;
- the air guiding board defines an air-flowing direction towards the circuit board when the air flows below the air guiding board and between the cooler and the air duct.
A heat dissipating apparatus comprising:
- a cooler secured to a circuit board of a host;
- an air duct, covering the cooler, comprising a side tray that is substantially perpendicular to the circuit board;
- a cooling fan, secured to the cooler, located on a side of the cooler and adjacent to the side tray;
- wherein a gap is defined between the side tray and the cooler, an air guiding board is located in the gap and extends towards a VRM that is secured to the circuit board, and the air guiding board is configured to direct air flowing towards the VRM.
Dependencies are inferred from the claim text.