Apparatus for manufacturing semiconductor devices
AssigneeS.O.I.Tec. On Insulator Technologies
InventorsMarcel Broekaart, Ionut Radu
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Abstract
The present invention relates to an apparatus for the manufacture of semiconductor devices wherein the apparatus includes a bonding module that has a pumping device; a vacuum chamber connected to the pumping device; and an optical system configured to determine the position of alignment marks on the surfaces of the semiconductor wafers to be bonded in the bonding module. The apparatus also includes a loadlock module connected to the bonding module and configured for wafer transfer to the bonding module. The loadlock module is also connected to a first vacuum pumping device configured to reduce the pressure in the loadlock module to below atmospheric pressure.
Claims22
A bonding module for bonding semiconductor wafers, comprising:
- a pumping device;
- a vacuum chamber connected to the pumping device;
- and
- an optical system configured to determine the position of alignment marks on the surfaces of the semiconductor wafers to be bonded in the bonding module.
An apparatus for the manufacture of semiconductor devices, comprising:
- a bonding module comprising a vacuum chamber to provide bonding of wafers under a pressure below atmospheric pressure;
- and
- a loadlock module connected to the bonding module and configured and dimensioned for wafer transfer to the bonding module and also connected to a first vacuum pumping device configured to reduce the pressure in the loadlock module to below atmospheric pressure.
Dependencies are inferred from the claim text.