Solder bonding entities to solid material
AssigneeHewlett-Packard Development Company, L.P.
InventorKarl S. Weibezahn
Life of this patent
Estimating the term…
Abstract
Methods and apparatus are provided for solder bonding entities to solid materials. One or more through apertures are formed in a solid material. Solder paste is introduced into each through aperture. Respective entities having solderable surface features are disposed in overlying alignment with the through apertures. The arrangement is heated causing molten solder paste to wet the solderable surface features and the solid material. Cooling results in the electrical and mechanical bonding of the entities to the solid material. Devices having substantially planar form factors and without lead wires can be electrically and mechanically secured to a supporting conductive stratum.
Claims17
A method, comprising:
- forming an aperture through a solid material, the solid material defined by a first side and a second side opposite the first side;
- providing a solder paste within the aperture;
- disposing an entity in overlapping relationship with the aperture and in contact with the first side of the solid material;
- and
- heating and then cooling the second side of the solid material so as to electromechanically bond the entity to the solid material by way of wicking at least a portion of the solder paste into contact with the entity.
A method of bonding an electronic entity to a conductive material, comprising:
- forming a through aperture in the conductive material;
- disposing a quantity of solder paste within the through aperture;
- bringing the electronic entity into contact with a first side of the conductive material, the electronic entity having a solderable surface feature aligned with the through aperture;
- heating a second side of the conductive material so as to reflow the solder paste into wetting contact with both the first side of the conductive material and the solderable surface feature;
- and
- cooling the conductive sheet such that the electronic entity is electrically and mechanically bonded to the conductive material.
An apparatus, comprising:
- an entity electromechanically bonded to a solid material by way of a solder, the entity defined by a solderable surface feature overlying a through aperture defined by the solid material, the solder being in bonded contact with the solderable surface feature and the solid material.
An apparatus including an electronic entity, comprising:
- a solderable solid material defining an aperture there through, the solderable solid material defined by a first side;
- and
- the electronic entity bonded to the first side of the solderable solid material in overlapping relationship with the aperture by way of solder, the solder being bonded to the entity and the first side of the solderable solid material about the aperture, the electronic entity having no feature extending into the aperture.
Dependencies are inferred from the claim text.