Printed wiring board and method for manufacturing the same

A method for manufacturing a printed wiring board, comprising:

• forming a pad having a protruding portion and an embedded portion on a metal film and a plated film formed on the metal film, the pad having a coating layer on the protruding portion, the protruding portion being formed in an opening portion formed in the plated film, the embedded portion being exposed over the plated film;
• forming on the plated film and the pad a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the first surface of the resin insulation layer facing the plated film and the pad;
• removing the metal film and the plated film from the first surface of the resin insulation layer such that the protruding portion of the pad protrudes from the first surface of the resin insulation layer;
• forming in the resin insulation layer an opening for a first via conductor reaching the pad from the second surface of the resin insulation layer;
• forming a first conductive circuit on the second surface of the resin insulation layer;
• and
• forming the via conductor in the opening of the resin insulation layer such that the first conductive circuit and the pad are connected.