Led lighting assemblies with thermal overmolding
AssigneeGE Lighting Solutions, LLC
InventorsJeffrey Nall, Matthew Mrakovich
Life of this patent
Estimating the term…
Abstract
One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
Claims21
A method of manufacturing a lighting assembly, the method comprising:
- attaching one or more light emitting diodes (LEDs) to a printed circuit board, the attached LEDs being connectable with a power source via circuitry of the printed circuit board;
- and
- insert molding an overmolding material over at least portions of the printed circuit board proximate to the LEDs, the overmolding material having a melting temperature greater than about 100° C. and having a thermal conductivity greater than or about 1 W/m·K.
A method of manufacturing a lighting assembly, the method comprising:
- attaching one or more light emitting diode diodes (LEDs) to a printed circuit board, the attached one or more LEDs being connectable with a power source via circuitry of the printed circuit board;
- and
- reflowing a thermoplastic over at least portions of the printed circuit board proximate to the one or more LEDs, the thermoplastic having a melting temperature greater than about 100° C. and having a thermal conductivity greater than or about 1 W/m·K.
A method comprising:
- attaching one or more light emitting diodes (LEDs) to a printed circuit board, the attached LEDs being connectable with a power source via circuitry of the printed circuit board;
- disposing the printed circuit board with the attached LEDs in a mold;
- injecting overmolding material in melted form into the mold, the melted overmolding material solidifying in the mold to define an overmolding secured to at least portions of the printed circuit board proximate to the LEDs;
- and
- after the solidifying, removing a light assembly from the mold, the light assembly comprising the one or more LEDs attached to the printed circuit board with the overmolding secured to at least portions of the printed circuit board proximate to the LEDs, the overmolding being free standing and having a melting temperature greater than about 100° C. and a thermal conductivity greater than or about 1 W/m·K.
Dependencies are inferred from the claim text.