Qfn process for strip test
AssigneeUTAC Thai Limited
InventorsSaravuth Sirinorakul, Somchai Nondhasitthichai
Life of this patent
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Abstract
A process for assembling semiconductor devices comprises encapsulating a leadframe matrix having semiconductor die mounted thereon in a mold compound. The leadframe matrix is partially singulated to electrically isolate each individual leadframe unit. A plurality of leadframe units is tested simultaneously. The leadframe matrix is completely singulated. Non compliant units are discarded.
Claims15
1-24. (canceled)
A system for assembling semiconductor devices comprising:
- a. means for providing a leadframe matrix having semiconductor devices mounted thereon;
- b. a cutting apparatus for partially singulating the leadframe matrix thereby forming partially singulated semiconductor devices;
- c. a contactor for contacting a plurality partially singulated semiconductor devices;
- d. means for transmitting at least one test signal to the plurality of partially singulated semiconductor devices;
- e. means for receiving at least one response signal from the partially singulated semiconductor devices;
- f. means for identifying any non compliant partially singulated semiconductor devices;
- g. a cutting apparatus for completely singulating the partially singulated semiconductor devices, thereby forming completely singulated semiconductor devices;
- and
- h. means for discarding any partially singulated semiconductor devices that did not respond according to a predetermined requirement.
The system of claim 19 wherein the cutting apparatus for partially singulating comprises a thin blade.
The system of claim 19 wherein the cutting apparatus for partially singulating comprises a standard blade.
The system of claim 19 wherein the cutting apparatus for partially singulating comprises a laser.
The system of claim 19 wherein the cutting apparatus for completely singulating comprises a thin blade.
The system of claim 19 wherein the cutting apparatus for completely singulating comprises a standard blade.
The system of claim 19 wherein the cutting apparatus for completely singulating comprises a laser.
The system of claim 19 wherein the means for providing a leadframe matrix having semiconductor devices mounted thereon comprises:
- a. means for providing a leadframe matrix having a plurality of individual leadframe units;
- b. means for mounting at least one semiconductor device in at least one of the leadframe unit, and;
- c. means for encapsulating the leadframe matrix in a mold compound.
The process of claim 19 wherein the means for encapsulating the leadframe matrix in a mold compound comprises means for placing the leadframe matrix between a top mold and a bottom mold and injecting mold compound in a liquid state such that it encapsulates the leadframe matrix.
The system of claim 19 wherein the at least one test signal comprises any among a DC voltage, an AC voltage, and a frequency.
The system of claim 19 wherein the at least one response signal comprises any among a DC voltage, an AC voltage, and a frequency
The system of claim 19 wherein the means for identifying non compliant partially singulated semiconductor devices comprises a computing means for comparing the at least one response signal to a predetermined expected response.
The system of claim 19 wherein the means for identifying non compliant partially singulated semiconductor devices further comprises a marking means for marking a non compliant partially singulated semiconductor device in a database.
The system of claim 19 wherein identifying non compliant partially singulated semiconductor devices further comprises physically marking a non compliant partially singulated semiconductor device for visual identification by an operator.
Dependencies are inferred from the claim text.