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US 2012/0066894 A1Published application
Low cost high frequency device package and methods
AssigneeBridgewave Communications, Inc.
InventorsEric A. Sanjuan, Sean S. Cahill
Life of this patent
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Abstract
A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.
Claims22
A process for creating a high frequency package, comprising:
- forming a conductive leadframe having one or more leads, said leadframe having top and bottom surfaces, said bottom surface forming one or more printed circuit board attachment areas, said top surface forming a wirebond and one or more conductive electrical component attachment areas;
- forming an insulating material around said conductive leadframe;
- attaching at least one electrical component to the one or more conductive electrical component attachment areas;
- and
- forming a waveguide between the at least electrical component and at least one of the leads of the leadframe.
2 more elements
A process for creating a high frequency package, comprising:
- providing a package having a plurality of leads and a base;
- attaching a structure to the base, the structure having at least one site;
- and
- forming at least one waveguide interconnect connecting the at least one site on the structure to at least one of said plurality of leads of the package.
1 more element
A process for creating a high frequency package, comprising:
- providing a package having a plurality of leads and a base;
- attaching one or more devices to the base, each device having at least one site;
- and
- forming at least one waveguide interconnect connecting the at least one site on a particular device attached to said base to the at least one site on a second particular device attached to said base.
1 more element
A process for creating a high frequency package, comprising:
- providing a package having a plurality of leads and a base;
- attaching a device to the base, each device having at least one site;
- and
- forming at least one waveguide interconnect, internal to the package, that connects the at least two sites on the device to each other.
1 more element
Dependencies are inferred from the claim text.