Thermosetting polyimide resin composition, cured product, and adhesive

A thermosetting polyimide resin composition comprising the following components (a) and (b):

• (a) a polyimide produced through reaction between a tetracarboxylic acid component containing a tetracarboxylic dianhydride represented by the following formula (1):
• (wherein R1 represents a C1 to C20 tetravalent chain saturated hydrocarbon group, a C2 to C20 tetravalent chain unsaturated aliphatic hydrocarbon group, a C4 to C20 tetravalent alicyclic hydrocarbon group, a C6 to C15 tetravalent aromatic hydrocarbon group, or a C13 to C20 substituted or unsubstituted aromatic-ring-containing chain saturated hydrocarbon group) and/or a tetracarboxylic acid represented by the following formula (2):
• (wherein R1 has the same meaning as defined above;
• and each of Y1 to Y4 represents a hydrogen atom or a C1 to C8 aliphatic hydrocarbon group), and a diamine represented by the following formula (3):
• H2N—X1—NH2 (3)
• (wherein X1 represents a C1 to C221 divalent organic group which is formed of an aliphatic hydrocarbon group, an alicyclic hydrocarbon group, an aromatic hydrocarbon group, or a combination thereof, and which optionally includes an ether group, a sulfonyl group, or a keto group in the structure thereof);
• and
• (b) a maleimide composition containing at least one polymaleimide compound represented by any of the following formulas (4-1) to (4-3):
• (wherein n is an integer from 1 to 10).