Substrate inductive devices and methods
AssigneePulse Electronics, Inc.
InventorsChristopher P. Schaffer, Aurelio J. Gutierrez
Life of this patent
Estimating the term…
Abstract
Methods and apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a substrate based inductive device which utilizes inserted conductive pins in combination with plated substrates which replace windings disposed around a magnetically permeable core. In some variations this is accomplished without a header disposed between adjacent substrates while alternative variations utilize a header. In another embodiment, the substrate inductive devices are incorporated into integrated connector modules. Methods of manufacturing and utilizing the aforementioned substrate based inductive devices and integrated connector modules are also disclosed.
Claims23
-6. (canceled)
A multi-port connector, comprising:
- a housing comprising a plurality of plug-receiving ports, the plug-receiving ports being arranged in a row-and-column fashion;
- and
- a substrate-based inductive device assembly, comprising:
- an insert assembly comprised of an insulative header and a plurality of plug-interfacing conductors, at least a portion of the plug-interfacing conductors in electrical communication with at least one substrate inductive device;
- a substrate inductive device comprised of a plurality of cores and a plurality of substrates, the substrates being arranged in a direction that is parallel to a plug insertion direction associated with the plug-receiving ports;
- and
- a plurality of circuit board interface terminals, the circuit board interface terminals in electrical communication with the at least one substrate inductive device.
-20. (canceled)
A multi-port connector, comprising:
- a housing comprising a front face, said front face comprising a plurality of plug-receiving ports, the plug-receiving ports being arranged in a row-and-column fashion;
- and
- a substrate-based inductive device assembly, comprising:
- a plurality of vertically oriented substrates, said vertically oriented substrates being arranged orthogonal to said front face;
- a plurality of ferromagnetic cores, said cores being disposed between adjacent ones of said vertically oriented substrates;
- and
- a plurality of conductors that connect said adjacent ones of said vertically oriented substrates.
Dependencies are inferred from the claim text.