US 2012/0058650 A1 · SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

Abstract

Example embodiments relate to semiconductor modules and semiconductor devices including the same. The semiconductor module may include a board, a plurality of semiconductor chips, a plurality of first taps, and a plurality of second taps. The board may include a chip region, a first tap region, and a second tap region. The first tap region of the board may have a first width that extends in a thickness direction of the board. The second tap region may have a second width that is less than the first width. The second tap region may be disposed under the first tap region. The semiconductor chips may be mounted in the chip region of the board. The first taps may be disposed in the first tap region, and the second taps may be disposed in the second tap region. The first and second taps may be configured to transmit/receive an electric signal to/from the plurality of semiconductor chips.

Claims20

Dependent claims

A semiconductor module, comprising:

a board including a chip region, a first tap region, and a second tap region, the first tap region having a first width extending in a first direction, the second tap region disposed under the first tap region, the second tap region having a second width extending in the first direction, the second width being less than the first width;
a plurality of semiconductor chips disposed in the chip region of the board;
a plurality of first taps disposed in the first tap region, the plurality of first taps configured to transmit/receive electric signals to/from the plurality of semiconductor chips;
and
a plurality of second taps disposed in the second tap region, the plurality of second taps configured to transmit/receive electric signals to/from the plurality of semiconductor chips.

2 more elements

A semiconductor device, comprising:

a semiconductor module including a board, a plurality of semiconductor chips, a plurality of first taps, and a plurality of second taps, the board including a chip region, a first tap region, and a second tap region disposed under the first tap region, the plurality of semiconductor chips disposed in the chip region, the plurality of first taps disposed in the first tap region, the first tap region having a first width, the plurality of second taps disposed in the second tap region, the second tap region having a second width less than the first width;
and
a socket configured to receive the semiconductor module.

A semiconductor module, comprising:

a board divided into a chip region, a first tap region, and a second tap region, the first tap region of the board having a first thickness, the first tap region disposed between the chip region and the second tap region, the second tap region disposed adjacent to an edge of the board, the second tap region of the board having a second thickness, the second thickness being less than the first thickness;
a plurality of semiconductor chips disposed in the chip region of the board;
a plurality of first taps disposed in the first tap region, the plurality of first taps configured to communicate electric signals with the plurality of semiconductor chips;
and
a plurality of second taps disposed in the second tap region, the plurality of second taps configured to communicate electric signals with the plurality of semiconductor chips.

2 more elements

Dependencies are inferred from the claim text.

Semiconductor module and semiconductor device including the same

Life of this patent

Semiconductor module and semiconductor device including the same

Life of this patent

Abstract

Claims20