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US 2012/0058623 A1Published application
Method for Thinning Wafer
AssigneeUnited Microelectronics Corp.
InventorCheng-Yu Hsieh
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Abstract
The present invention provides a method of thinning a wafer. First, a wafer is provided. The wafer includes an active surface, a back surface and a side surface. The active surface is disposed opposite to the back surface. The side surface is disposed between the active surface and the back surface and encompasses the peripheral of the wafer. Next, a protective structure is formed on the wafer to at least completely cover the side surface. Last, a thinning process is performed upon the wafer from the back surface.
Claims20
A method for thinning a wafer, comprising:
- providing a wafer comprising an active surface, a back surface disposed opposite to the back surface, and a side surface disposed between the active surface and the back surface, wherein the side surface encompasses the peripheral of the wafer;
- forming a protective structure on the wafer, wherein the protective structure at least completely covers the side surface;
- and
- performing a thinning process upon the wafer from the back surface.
1 more element
Dependencies are inferred from the claim text.