Method of Fabricating A Semiconductor Device Having A Resin With Warpage Compensated Structures

A method of mounting a semiconductor device, the method comprising:

• providing a semiconductor device including a die, a die pad, a mounting aperture, an isolation thickness on the die pad and a major surface having a non warpage compensation portion at least directly under the die and a warpage compensation portion adjacent the mounting aperture in a relatively thermally inactive zone, wherein the major surface has an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion;
• providing a mounting medium between the semiconductor device and a heat sink;
• and
• mounting the semiconductor device to the heat sink.

A method of forming a semiconductor device, the method comprising:

• providing a die pad;
• providing a die disposed on the die pad;
• encapsulating the die pad and the die with a resin, the resin forming a first portion and a second portion, the first portion of the resin disposed over and under the die and having a first thickness, the second portion of the resin laterally spaced from the first portion and having a second thickness smaller than the first thickness, each of the first and the second portions of the resin having a top surface over the die and the die pad, and an opposite back surface under the die and the die pad, the back surface of the first portion and the back surface of the second portion forming a common back surface configured for mounting an external device;
• and
• forming a mounting aperture in the resin, the mounting aperture being defined by the second portion of the resin, wherein the back surface of the first portion comprises a curved surface, and wherein the back surface of the second portion comprises a substantially flat surface.

A method of forming a semiconductor device, the method comprising:

• providing a die pad;
• placing a die over the die pad;
• placing the die and the die pad in a mold cavity;
• and
• forming an uncured resin surrounding the die pad and the die, the uncured resin comprising a first portion and a second portion along a first direction, the first portion of the uncured resin disposed over and under the die, the first portion having a first thickness along a second direction perpendicular to the first direction, the second portion of the uncured resin disposed adjacent the die, the second portion having a second thickness along the second direction, the second thickness being smaller than the first thickness, each of the first and the second portions of the uncured resin having a top surface over the die and the die pad, and an opposite back surface under the die and the die pad, wherein the back surface of the first portion comprises a substantially flat surface, and wherein the back surface of the second portion comprises a wedge protruding away from the substantially flat surface, wherein a maximum thickness of the wedge along the second direction is located at a top end of the second portion of the uncured resin.