Method for packaging led chip modules and moving fixture thereof
AssigneeNational Cheng Kung University
InventorsRay-Hua Horng, Jhih-Sin Hong
Life of this patent
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Abstract
A method for packaging LED chip modules is provided. First, a first sacrificial layer is disposed on a substrate. Afterwards, LED chips are synchronously disposed on the first sacrificial layer before the first sacrificial layer cures. Next, a first material, a second sacrificial layer, and a second material are used to form a support layer on the first sacrificial layer. The first sacrificial layer and the second sacrificial layer are then removed, so that LED chip modules are obtained, wherein each LED chip module has a corresponding support layer. Furthermore, a moving fixture is provided to synchronously remove chips from a wafer and dispose them on the sacrificial layer.
Claims18
A method for packaging LED chip modules, suitable for mass-producing multiple LED chip modules, each of the LED chip modules comprising at least one LED chip, said method for packaging comprising the steps of:
- disposing a first sacrificial layer on a substrate;
- synchronously disposing multiple LED chips on said first sacrificial layer before said first sacrificial layer has been cured;
- forming a support layer from a first material, a second sacrificial layer, and a second material on said cured first sacrificial layer, wherein a module pattern is defined in said second sacrificial layer, and said support layer comprises said first material and said second material;
- and
- removing said first sacrificial layer and said module pattern, so as to obtain said LED chip modules, wherein each of said LED chip modules comprises said corresponding support layer.
A moving fixture, suitable for moving multiple LED chips synchronously, said moving fixture comprising:
- an upper molding board having a vacuum chamber;
- a lower molding board having multiple through-holes, wherein said through-holes pass through a body of said lower molding board and communicate with said vacuum chamber;
- and
- a carrying disc having multiple accommodating locations, into which said LED chips are placed, wherein said LED chips placed in said carrying disc are adapted to be sucked synchronously by said moving fixture using vacuum suction.
Dependencies are inferred from the claim text.