Method for depositing metal on a substrate; metal structure and method for plating a metal on a substrate
AssigneeInfineon Technologies AG
InventorsMarkus Zistler, Stephan Bradl
Life of this patent
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Abstract
Various embodiments provide a method for depositing metal on a substrate. The method may include carrying out a first immersion plating process, thereby forming a first metal portion on the substrate; providing an immersion plating activating substance on the first metal portion; and carrying out a second immersion plating process using the immersion plating activating substance, thereby forming a second metal portion on the first metal portion.
Claims24
A method for depositing metal on a substrate, the method comprising:
- carrying out a first immersion plating process, thereby forming a first metal portion on the substrate;
- providing an immersion plating activating substance on the first metal portion;
- carrying out a second immersion plating process using the immersion plating activating substance, thereby forming a second metal portion on the first metal portion.
A metal structure, comprising:
- a substrate;
- an immersion plated first metal portion above the substrate;
- an immersion plated second metal portion on the first metal portion;
- and
- an immersion plating activating substance between the first metal portion and the second metal portion.
A method for plating a metal on a substrate, the method comprising:
- carrying out a first immersion plating partial process to form a first metal layer on the substrate;
- providing an immersion plating activator on the first metal layer;
- carrying out a second immersion plating partial process to form a second metal layer on the first metal layer, wherein the immersion plating activator acts as an activator for the second immersion plating partial process.
Dependencies are inferred from the claim text.