Temporary fixing sheet for manufacturing process of electronic parts
AssigneeNitto Denko Corporation
InventorsDaisuke SHIMOKAWA, Yuta SHIMAZAKI, Kunio NAGASAKI, Eiichi IMOTO
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Abstract
The present invention provides a temporary fixing sheet which firmly holds a ceramic sheet in a cutting step for the ceramic sheet and the like, can provide high cutting accuracy, and then can efficiently and easily peel a chip from itself by being cooled to a predetermined temperature or lower, with a high degree of freedom in designing and adequate handleability. The temporary fixing sheet includes a supporting substrate and a temporary fixing layer provided on at least one face thereof, wherein the temporary fixing layer contains a urethane polymer and a vinyl polymer.
Claims8
A temporary fixing sheet for a manufacturing process of electronic parts comprising a supporting substrate and a temporary fixing layer provided on at least one face thereof, wherein the temporary fixing layer contains a urethane polymer and a vinyl polymer.
Dependencies are inferred from the claim text.