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AssigneeTokyo Electron Limited
InventorsAkira Miyata, Kenichirou Matsuyama, Kunie Ogata
Estimating the term…
Provided is a substrate processing apparatus in which after a module is disabled, a substrate is provided to a carry-in module capable of placing the wafers most rapidly in the plurality of unit blocks and the substrates are sequentially transported to the module group by the transportation means to be delivered to the carry-out module according to a providing sequence of the substrate to the carry-in module in each of the plurality of unit blocks. In particular, the substrates are extracted from the carry-out module according to a providing sequence of the substrate to the carry-in module and transported to a rear module or a substrate placing part. Thereafter, the substrates are transported to the rear module from the carry-out module or the substrate placing part according to a predetermined sequence in which the substrate is provided to the carry-in module in a normal state.
A substrate processing apparatus including a plurality of layers of unit blocks transporting substrates placed in a carry-in module to a module group in which each substrate is placed and a transportation sequence is determined by a transportation means one by one to be delivered to a carry-out module at a downstream end of the module group and performing the same processing with respect to the substrates, comprising:
A substrate processing method by a substrate processing apparatus including a plurality of layers of unit blocks transporting substrates placed in a carry-in module to a module group in which each substrate is placed and a transportation sequence is determined by a transportation means one by one to be delivered to a carry-out module at a downstream end of the module group and performing the same processing with respect to the substrates, where the substrate processing apparatus includes:
Dependencies are inferred from the claim text.