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US 2012/0057729 A1Published application
Mems microphone package
OwnerLutz RAUSCHERinventor
Life of this patent
Estimating the term…
Abstract
A microelectromechanical system microphone package has at least one sensitive diaphragm provided in the front side of a microphone component. The microphone component and a cap wafer are connected to one another with their front sides facing one another. The cap wafer functions as an intermediate wafer for installing the microelectromechanical system microphone package. The cap wafer is provided with feedthroughs so that the microphone component is electrically contactable via the cap wafer.
Claims13
A microelectromechanical system microphone package, comprising:
- a microphone component having at least one acoustically sensitive diaphragm provided in the front side of the microphone component;
- a cap wafer configured to protect the diaphragm;
- and
- means for electrically contacting the microphone component;
- wherein i) a structured back side of the cap wafer is connected to the front side of the microphone component, ii) sound is introduced via at least one sound opening in the back side of the microphone component, and iii) the microphone component is provided with feedthroughs configured to enable the microphone component to be electrically contacted from the back side of the microphone component.
2 more elements
A microelectromechanical system microphone package, comprising:
- a microphone component having at least one acoustically sensitive diaphragm provided in the front side of the microphone component;
- a cap wafer configured to protect the diaphragm;
- and
- means for electrically contacting the microphone component;
- wherein i) the microphone component and the cap wafer are connected to one another with front sides of the microphone component and the cap wafer facing one another, ii) the cap wafer functions as an intermediate wafer for installing the microelectromechanical system microphone packages, and iii) the cap wafer is provided with feedthroughs configured to enable the microphone component to be electrically contacted via the cap wafer.
2 more elements
Dependencies are inferred from the claim text.