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US 2012/0057305 A1Published application
Semiconductor unit
AssigneeKabushiki Kaisha Toyota Jidoshokki
InventorsNaoto Morisaku, Hirokuni Akiyama
Life of this patent
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Abstract
The semiconductor unit includes a wiring board, a conductor layer and a fin. The wiring board has across a thickness thereof a first surface and a second surface. The conductor layer is formed on the first surface of the wiring board. The conductor layer has a length and a width as viewed in the direction of the thickness of the wiring board. The fin is joined to the second surface of the wiring board. The fin has a bent edge that extends in the direction of the length of the conductor layer.
Claims11
A semiconductor unit comprising:
- a wiring board having across a thickness thereof a first surface and a second surface;
- a conductor layer formed on the first surface of the wiring board, the conductor layer having a length and a width as viewed in the direction of the thickness of the wiring board;
- and
- a fin joined to the second surface of the wiring board, the fin having a bent edge that extends in the direction of the length of the conductor layer.
1 more element
Dependencies are inferred from the claim text.