Back to results
US 2012/0056684 A1Published application
Method of fabricating resonator, resonator, and oscillator
AssigneeFujitsu Limited
InventorsMasakazu KISHI, Masayuki Itoh
Life of this patent
Estimating the term…
Abstract
There is provided a method of fabricating a resonator, the method includes, joining a vibrating plate with a substrate at a first surface thereof, grinding a surface of the vibrating plate joined with the substrate, forming an electrode on the ground surface of the vibrating plate, and etching electively a region at a second surface of the substrate, where the second surface is opposite to the first surface and the region is corresponding to a position of the electrode.
Claims16
A method of fabricating a resonator, comprising:
- joining a vibrating plate with a substrate at a first surface of the substrate;
- grinding a surface of the vibrating plate joined with the substrate;
- forming an electrode on the ground surface of the vibrating plate;
- and
- etching electively a region at a second surface of the substrate, the second surface being opposite to the first surface, the region corresponding to a position of the electrode.
2 more elements
A resonator comprising:
- a substrate including a first and a second surfaces opposite to each other, the first surface including a recess;
- a vibrating plate bonded to a region of the second surface, the region formed at a position opposing to a position of the recess;
- and
- an electrode formed on the vibrating plate,
- wherein a portion of the substrate at a bottom of the recess is made to be electrically conductive and serves as an opposite electrode opposing to the electrode.
2 more elements
A resonator comprising:
- a substrate including a through hole;
- a vibrating plate formed on a surface of the substrate so as to cover an end of the through hole;
- a first electrode formed on the vibrating plate;
- and
- a second electrode formed on a portion of the vibrating plate so as to oppose to the first electrode, the portion exposed through the through hole.
2 more elements
An oscillator comprising:
- a resonator including;
- a semiconductor substrate including a first and a second surfaces opposite to each other, the first surface including a recess,
- a vibrating plate bonded to a region of the second surface, the region formed at a position opposing to a position of the recess, and
- an electrode formed on the vibrating plate,
- wherein a portion of the substrate at a bottom of the recess is made to be electrically conductive and serves as an opposite electrode opposing to the electrode,
- an oscillation circuit formed on the semiconductor substrate for oscillating the resonator;
- and
- a housing for covering the resonator and the oscillation circuit.
5 more elements
An oscillator comprising:
- a resonator including;
- a semiconductor substrate including a through hole,
- a vibrating plate formed on a surface of the semiconductor substrate so as to cover an end of the through hole,
- a first electrode formed on the vibrating plate, and
- a second electrode formed on a portion of the vibrating plate so as to oppose to the first electrode, the portion exposed through the through hole;
- an oscillation circuit formed on the semiconductor substrate for oscillating the resonator;
- and
- a housing for covering the resonator and the oscillation circuit.
5 more elements
Dependencies are inferred from the claim text.