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US 2012/0056510 A9Published application
Integration of piezoelectric materials with substrates
AssigneeSand9, Inc.
InventorsDavid M. Chen, Jan H. Kuypers, Alexei Gaidarzhy, Guiti Zolfagharkhani, Jason Goodelle
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Abstract
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
Claims27
A packaged micromechanical resonator, comprising:
- a substrate;
- a cap comprising integrated circuitry;
- a first portion of an electrically conductive material between the substrate and the cap, disposed such that the substrate, the cap, and the first portion of the electrically conductive material define a sealed, enclosed volume;
- a micromechanical resonator comprising a piezoelectric material disposed within the enclosed volume;
- and
- a second portion of the electrically conductive material between the substrate and the cap constructed and arranged such that a signal can be transmitted between the micromechanical resonator and the integrated circuitry through the second portion of the electrically conductive material.
3 more elements
A packaged micromechanical resonator, comprising:
- a substrate;
- a cap comprising integrated circuitry;
- a first portion of an electrically conductive material between the substrate and the cap, disposed such that the substrate, the cap, and the first portion of the electrically conductive material define a sealed, enclosed volume;
- a micromechanical resonator disposed within the enclosed volume;
- and
- a second portion of the electrically conductive material between the substrate and the cap constructed and arranged such that a signal can be transmitted between the micromechanical resonator and the integrated circuitry through the second portion of the electrically conductive material;
- wherein the first and/or second portions of the electrically conductive material have an average thickness of at least about 5 microns.
4 more elements
A packaged micromechanical resonator, comprising:
- a substrate;
- a cap comprising integrated circuitry;
- a first portion of an electrically conductive material between the substrate and the cap, disposed such that the substrate, the cap, and the first portion of the electrically conductive material define a sealed, enclosed volume;
- a micromechanical resonator configured to oscillate in plane disposed within the enclosed volume;
- and
- a second portion of the electrically conductive material between the substrate and the cap constructed and arranged such that a signal can be transmitted between the micromechanical resonator and the integrated circuitry through the second portion of the electrically conductive material.
3 more elements
A method of packaging a micromechanical resonator, comprising:
- providing a substrate on which a micromechanical resonator is disposed;
- providing a cap comprising integrated circuitry;
- positioning first and second portions of an electrically conductive material between the substrate and the cap;
- and
- modifying the first and second portions of the electrically conductive material such that the first portion of the electrically conductive material produces a seal between the substrate and the cap and such that a signal can be transmitted between the micromechanical resonator and the integrated circuitry through the second portion of the electrically conductive material.
2 more elements
Dependencies are inferred from the claim text.